■TCB (Thermal Compression Bonding) Tools
- AlN 기반으로 제작된 고열방출 특성을 가진 TCB 툴
Requirements |
Our Strength |
Thermal conductivity |
High thermal conductivity (≥ 180W/mK) ? Working efficiency |
Hardness |
Over 1200 Hv? Long life time |
Dimension |
Within ±10um For better Placement accuracy |
Flatness |
Under 2um ? Stability for Bump soldering uniformity |
Thermal Expansion |
Under 5ppm < 1000 °CFor better placement accuracy |
|
General Product |
Innertron TC Bonding Tool |
||
Flatness |
Parallelization |
Flatness |
Parallelization |
|
Top |
2.0um |
- |
1.8um |
- |
Bottom |
- |
2.0um |
- |
1.7um |
|
Innertron TC Bonding Tool |
|
Flatness |
Parallelization |
|
Side A |
- |
1.0um |
Side B |
1.0um |
1.9um |
패밀리 사이트